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CompactPCI平臺

Advantech 的 CompactPCI 與 VPX 解決方案是利用最新技術所設計,能為強固型設計、耐用性、熱插入及 CT 總線提供絕佳支持。 上述所有特色都融合在簡便擴充的「歐規卡 (Eurocard)」CPCI 與 VPX 尺寸規格之中。 憑借在 CompactPCI 周邊適配卡與系統設計十多年的豐富經驗,我們已經為世界各地的 OEM 廠商供應了數以千計的產品。 Advantech 的 CompactPCI 平臺廣泛用于關鍵的工業及電信應用領域,這些領域對于高可靠性、可用性、服務性以及長期可升級性與可管理性具有高度的要求。 Advantech 的支持團隊及合作伙伴十分重視本地的專業技能的與經驗,提供現場咨詢服務為您處理最新設計的驅動程序與軟件兼容性問題。

產品型錄

  • 3U VPX

    研華 3U VPX CPU刀片兼容OpenVPX規范 ,可提供高速、低延遲和可擴展的互連性,可寬溫工作并具有靈活的開發工具

    • MIC-6030

      The MIC-6030 is a ruggedized single-slot 3U OpenVPX switch providing high-speed, low-latency interconnects between VPX blades connected to PCI Express and Ethernet backplane fabrics. An ExpressLane? PEX8733 PCIe Gen3 switch connects to six PCIe Gen3 x4 ports enabling non-transparent and transparent bridging of processor blades for highly flexible multi-host and legacy configurations. A Marvell® Link Street® 88E6390X Ethernet layer 2 switch with VLAN support switches gigabit Ethernet traffic between VPX blades connected to the Ethernet fabric enabling a linerate control plane. When configured with optional Mellanox ConnectX®-4 Multi-Host? Technology and drivers, the MIC-6030 enables high speed communication of up to 10Gbps bandwidth between up to 4 processor VPX blades VPX by transforming the PCIe bus into a programmable network interface, facilitating the development of data communication between boards and eliminating the need to program a more complex DMA interface. The onboard BMC firmware based on Advantech’s IPMI core technology brings an advanced set of system management features and can be customized when unique features are required. Lightweight switch management is available via the BMC, supporting tagged and untagged VLANs, port-based VLAN, and port status reporting. Advantech offers standard designs with either convection or conduction-cooling. A conduction-cooled heatsink ensures operation in harsher environments, providing a reliable solution for operation in extended temperatures, and where extreme shock and vibration requirements must be met. The MIC-6030 is compact, light and robust, meeting stringent size, weight, and power (SWAP) demands.
    • MIC-6330

      Based on the Intel® Xeon® E3 Lv5 and Lv6 embedded platform, the MIC-6330 builds on the success of Advantech’s 6U VPX boards, and is the first 3U VPX product launched by Advantech. Together with the Intel® processor, the MIC-6330 offers intense computational ability in a very compact form factor. The MIC-6330 provides configurable connectivity (up to four ports) of PCI Express via the backplane to the highest performance mainstream peripherals and I/O cards, and vast I/O functions for extended interconnectivity and controllability. The MIC-6330 meets various computing needs, including vPro? and workstation capabilities, by using the Intel® CM236/CM238 PCH. The MIC-6330 offers high storage capacity at up to SATA 6Gbps transfer speed. Four USB2.0 ports and one USB 3.0 port to the backplane fulfill requirements for extra I/O ports or storage, up to 5Gbps data rate. Four GbE ports (two ports configurable as SERDES) support system level IP connectivity, and the UART interfaces (RS-232/422/485 selectable) can be leveraged as an interface to legacy devices and consoles. Like Advantech’s 6U VPX products, the MIC-6330 supports multiple displays, and the maximum resolution of the MIC-6330 is 4K, empowered by the Intel® integrated graphics engine. The MIC-6330 also offers a High Definition Audio to the backplane interface for media demands. With the standard ruggedized convection cooled heatsink or the optional air-cooled heatsink, the MIC-6330 is tailored for harsh environmental applications and adaptable to various chassis designs. The industrial NAND Flash, and the soldered onboard DDR4 ECC memory chips are appropriate for a variety of vehicle applications for the maximum reliability. The MIC-6330 is sophisticated and suitable for various purposes. An onboard X8D XMC site with PCIE x8 gen.3 connectivity can host high speed offload or I/O mezzanines for project-specific applications. For applications that need the maximum expandability, the XMC interface can be modified to add another DisplayPort and the 2 more UART. The optional front I/O module facilitates the development and qualification process, and also enables the possibility of the front panel access.
  • VPX

    以 VPX 標準為架構的新一代嵌入式運算系統反映出日趨重要的高速序列交換式結構互連,這些系統提供更強大的功能,漸漸取代本機通訊的傳統平行通訊總線架構。 研華的 VPX 產品線利用全新的高速連接器為交換式結構提供支持,特別著重于防護式應用,采用能為應用程序及平臺提供卓越效能的增強型模塊標準。

    • MIC-6314

      The MIC-6314 is Advantech’s next generation single processor 6U VPX blade, based on the 4th/ 5th Generation Intel® Core? embedded platform with increased cache size and efficiency, as well as instruction set improvements. The MIC-6314 provides two configurable PCIE x 8 ports in the VPX data plane and two PCI Express ports x8 lanes in the VPX expansion plane to enable the highest performance available in the 6U VPX form factor compute intense applications. These PCIE interfaces offer high speed up to PCIE gen. 2 (5Gb/s) throughput, low latency, scalable, error recoverable deterministic interconnectivity to the mainstream peripherals and I/O cards such as DSP and FPGA cards. The PCIE widths and ports on the data plane and the extension plane of MIC-6314 is user configurable, which make MIC-6314 capable to replace the PCIE switch blade in a small system. With a SO-DIMM socket and additional soldered, onboard DRAM with ECC in a dual channel design running up to 1600MT/s, the MIC-6314 can be integrated into various harsh environments while maintaining maximum memory throughput, and supports memory expansion by using the latest SO-DIMM technology simultaneously. Tailored for harsh environments, the MIC-6314 has a native ruggedized convection cooled heat sink adaptable to various chassis environments; with the alternated optional air cooled heat sink, additional I/O is provided on the front panel. An onboard soldered, industrial SSD is included for maximum reliability, and a SSD socket is also available for a cost-efficient, modular storage. By using Intel®’s powerful PCH (Lynx Point) with its advanced SATA controller, the MIC-6314 offers high storage capacity at up to 6Gbps transfer speed. An onboard XMC site with PCIe x8 gen.3 connectivity can host high speed offload or I/O mezzanines. Two USB 3.0 ports on the front panel can connect to external devices with up to 5Gbps data rate. Network and remote connectivity can be achieved via a RS-232 console (RJ-45) and two GbE RJ-45 ports, powered by Intel®’s latest Gigabit Ethernet controller. The Intel® next generation graphics engine Iris Pro offers up to 2x the graphic performance compared to previous generation solutions. Triple independent display support can be implemented by using VGA and 2 DVI ports on MIC6314. Audio is powered by a ALC892 controller via the backplane interface, and provides media support. A PCIEinterface is reserved for the optional M.2 high speed storage.Besides the modern M.2 storage, three SATA III one SATA II and four USB ports (2x USB 3.0, 2x USB 3.0) are also connected to the backplane to fulfill the demand for extra IO ports or storage. Four GbE ports (two SERDES selectable) support system level IP connectivity, and four UART interfaces (RS232/422/485selectable) can be leveraged to interface to legacy devices and consoles.
    • MIC-6313

      The MIC-6313 is Advantech’s next generation single processor 6U VPX blade, based on the 4th/ 5th Generation Intel® Core? and Intel® Xeon® Processor E3 Lv4 embedded platform. To enable the highest performance available in the 6U VPX form factor for workstation and compute intense applications, the four Serial RapidIO ports in the VPX data plane offer high speed up to 5Gb/s, low latency, scalable, error recoverable deterministic interconnectivity to digital front ends such as DSP and FPGA cards. In addition, two PCI Express ports x8 lanes in the VPX expansion plane, with up to PCI Express gen. 2 (5Gb/s) throughput offer a high performance interface to mainstream peripherals and I/O cards. With a SO-DIMM socket and additional soldered, onboard DRAM with ECC in a dual channel design running up to 1600MT/s, the MIC-6313 can be integrated into various harsh environments while maintaining maximum memory throughput, and supports memory expansion by using the latest SO-DIMM technology simultaneously. In addition, the 4th/ 5th generation Intel® Core? and Xeon® E3 Lv4 embedded processors offer increased cache size and efficiency, as well as instruction set improvements, which make the MIC-6313 a high performance compute engine with outstanding floating point and vector processing performance. Tailored for harsh environments, the MIC-6313 has a native ruggedized convection cooled heat sink adaptable to various chassis environments; with the alternative optional air cooled heat sink, additional I/O is provided on the front panel. An onboard soldered, industrial SSD is included for maximum reliability, and a CFast/ SSD socket is also available for a costefficient, modular storage. By using Intel®’s powerful PCH (Lynx Point) with its advanced SATA controller, the MIC-6313 offers high storage capacity at up to 6Gbps transfer speed. An onboard XMC site with PCIe x8 gen.3 connectivity can host high speed offload or I/O mezzanines. Two USB 3.0 ports on the front panel can connect to external devices with up to 5Gbps data rate. Network and remote connectivity can be achieved via a RS-232 console (RJ-45) and two GbE RJ-45 ports, powered by Intel®’s latest Gigabit Ethernet controller. The next generation graphics engine Intel® Iris Pro offers up to 2x the graphic performance compared to previous generation solutions. Triple independent display support can be implemented by using the MIC-6313’s DVI front panel port and two DVI interfaces on rear transition modules. Audio is powered by a ALC892 controller via the backplane interface, and provides media support. Four SATA ports (SATAIII) and four USB ports (2x USB 3.0, 2x USB 3.0) are also connected to the backplane to fulfill the demand for extra IO ports or storage. Four GbE ports (two SERDES selectable) support system level IP connectivity, and four UART interfaces (RS232/422/485 selectable) can be leveraged to interface to legacy devices and consoles.
    • MIC-6311

      Advantech’s MIC-6311 is a single processor VPX blade based on the 4th generation Intel® Core? i3/i5/i7 platform. It enables the highest performance available in 6U VPX form factor with two SRIOx4 ports in the VPX data plane and two PCI Express x8 gen. 3 lanes in the VPX expansion plane for workstation and compute intense applications. The two Serial RapidIO ports offer the possibility to interface the MIC-6311 to digital front ends such as DSP and FPGA cards via a high speed, low latency deterministic interconnect. In addition, PCI Express ports with up to 8GB/s throughput offer a high performance interface to mainstream peripherals and IO cards. With a SO-DIMM socket and additional soldered, onboard DRAM with ECC in a dual channel design running up to 1600MT/s, the MIC-6311 offers the ability to fit harsh environments while maintaining maximum memory throughput and supporting memory expansion using the latest SO DIMM technology. Moreover, the 4th generation Intel® Core? processors offer increased cache size and efficiency as well as instruction set improvements which make the MIC-6311 a high performance compute engine with outstanding floating point and vector processing performance. Tailored for rugged environments, MIC-6311 has been designed to support ruggedized convection cooled heat sinks. Additionally, it implements an onboard soldered, industrial SSD for maximum reliability. By using the latest powerful PCH (Lynx Point) from Intel®, with its advanced SATA controller advanced storage options are supported such as a 2.5" SATA III HDD/SSD socket offering high storage capacity with up to 6Gbps transfer speed. A CFast socket provides an alternative for implementing a cost efficient, pluggable SSD. An onboard XMC/PMC site with PCIe x8 gen.3 connectivity can host high speed offload or I/O mezzanines. Two USB 3.0 ports in front panel can connect to the external devices with up to 5Gbps data rate. Network and remote connectivity can be achieved via a RS232 console (RJ45) and two GbE RJ45 ports, powered by Intel®’s latest Gigabit Ethernet Controiller, the i350. The processor’s integrated enhanced graphics engine Iris offers up to 2x the graphic performance compared to previous generation solutions. Triple independent display support can be implemented by using the MIC-6311’s VGA front panel port and two Display port / HDMI interfaces on rear transition modules. Audio port support via the backplane interface enhances media support. Three SATA ports (SATAIII) and four USB ports (2x USB 3.0, 2x USB 3.0) are also connected to backplane to fulfill the demand for extra IO ports or storage. Two GbE/ SERDES ports support system level IP connectivity and two UART interfaces can be leveraged to interface to legacy devices and consoles.
  • 3U CompactPCI

    研華3U CompactPCI包含CPCI平臺和CPCI機箱。研華公司與 CompactPCI?外圍設備制造商緊密合作,并提供從1U到12U的各種機箱。

    • 3U CompactPCI

      研華的工業自動化事業部負責設計及制造眾多的 3U CompactPCI 產品,以符合工業通訊與數據擷取的需求。 研華的 3U CompactPCI 是工業自動化的最佳選擇。 單擊此鏈接了解完整信息。
    • CPU 板

      3U CompactPCI CPU 板
  • 6u CompactPCI板

    包含 Advantech 的 Intel? 架構 6U CompactPCI 單板計算機、后走線模塊及周邊機板 (包括 XMC 與 PMC)。 Advantech 的 6U CompactPCI、XMC 及 PMC 支持眾多的工業自動化事業部產品。 工業通訊與數據擷取適用的 3U CompactPCI 產品。 單擊此鏈接了解完整信息。

    • 主CPU板

      研華 CompactPCI 單板計算機可用于許多配置。 機板涵蓋從關鍵應用所需的高效能 CPU 機板,到適合多用途跨產業應用的更全面處理器機板。 我們的高效能 6U CompactPCI 機板采用最新的處理器技術,能針對加速、卸除、繪圖、網絡及儲存提供卓越的 I/O 擴充性。
    • 載板

    • 后面傳輸板

      研華提供 CompactPCI 后走線板,以符合各種 CompactPCI 平臺的需求。 我們提供最齊全的 CompactPCI 后走線板,方便接取 研華CPU 機板的 I/O 接口。
  • 6u CompactPCI機箱

    Advantech 與許多供應 1U 至 12U 機殼的 CompactPCI? 機柜制造商保持密切合作關系。 我們提供 6U CompactPCI 機柜,為您的 CPCI 平臺與 CPCI 機殼提供支持。

    • for 6U CompactPCI

      for 6U CompactPCI
    • 4U機柜

      研華提供 4U 機柜,以符合各種 CompactPCI 機柜 (CPCI 機柜) 的需求。 具有高可用性的 CompactPCI 8 插槽機柜標榜充足的擴充空間,適合用于運算密集的刀鋒服務器 (服務器彈性音頻路由矩陣) 及中等規模的新世代網絡應用,例如網絡電信交換機及訊號網關。 研華的 CompactPCI 機柜是 CompactPCI 的最佳選擇。
  • 外圍板卡

    Advantech 的 CompactPCI 解決方案包含 CPCI 周邊機板及載板,是利用最新技術所設計,能為強固型設計、耐用性、熱插入及 CT 總線提供絕佳支持。 上述所有特色都融合在簡便擴充的「歐規卡 (Eurocard)」CPCI 尺寸規格之中。 Advantech 持續履行開發、供應及支持 CompactPCI? 產品線的承諾。 憑借在 CompactPCI 周邊機板與系統設計十多年的豐富經驗,我們已經為世界各地的 OEM 廠商供應了數以千計的產品。 Advantech 的 CompactPCI 平臺廣泛用于關鍵的工業及電信應用領域,這些領域對于高可靠性、可用性、服務性以及長期可升級性與可管理性具有高度的要求。 Advantech 的 CompactPCI 載板是采用最新的 Intel? 硅芯片所設計,為舊型產品提供全面的升級管道,并為全新設計奠定堅實的基礎。

    • PMC模塊

      研華提供全系列 CPCI 接口設備適用的 CPCI PMC 模塊。 CPCI PMC 模塊包含多種 IEEE P1386.1 PMC 規范兼容模塊,適用于 CPU 機板的 LAN 聯機能力擴充。
    • 報警模塊

      研華提供警報模塊,以符合各種 CompactPCI 周邊模塊的需求。 研華利用獨立于系統之外作業的智能型監控模塊來偵測系統異常狀況,并允許用戶在發生系統故障之前采取措施,是 CompactPCI 接口設備的最佳選擇。
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